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EDAPS — 2018 IEEE Electrical Design of Advanced Packaging and Systems Symposium

16th December 2018 - 18th December 2018
Chandigarh, India
http://www.edaps2018.org/committees.php
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Abstract

• Power Integrity / Power Distribution Networks (PDNs) / Ground Noise • Computational Electromagnetics and Multi-physics Methods for SI / PI / TI Analysis • Design and Modeling for High-speed Channels and Interconnects • High speed serial links jitter budgeting. • Jitter segregation algorithms and tools • Power supply induced jitter and transfer functions. • IC and Package Level EMC • Antennas in Packages (AiP) • RF/mm-wave and THz Packages • Advanced Simulation Tools and CAD • Electrical Design for 5G Wireless Communication • DDR’s Signal and Power integrity considerations. • Electrical Design of Flexible Devices and Sensing

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