EDAPS - Electrical Design of Advanced Packaging and Systems Symposium

14th December 2015   -   16th December 2015
Seoul, South Korea
http://www.edaps2015.org/main/default.asp
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Abstract

The IEEE Electrical Design of Advanced Packaging and Systems (EDAPS) Symposium is the premier international conference in Asia-Pacific region to share the recent progress of modeling, simulation and measurement for the electrical design issues on chip, package and system levels.

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