ECTC - 2018 IEEE 68th Electronic Components and Technologies Conference
Date :
29th May 2018   -   1st June 2018
Location :
San Diego, California, United States
Abstract :
ECTC is the premier international conference sponsored by the IEEE Components, Packaging and Manufacturing Technology (CPMT) Society. ECTC papers comprise a wide spectrum of topics, including 3D packaging, electronic components, materials, assembly, interconnections, device and system packaging, optoelectronics, reliability, and simulation
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