EDAPS - Electrical Design of Advanced Packaging and Systems Symposium
Date :
14th December 2015   -   16th December 2015
Location :
Seoul, South Korea
Abstract :
The IEEE Electrical Design of Advanced Packaging and Systems (EDAPS) Symposium is the premier international conference in Asia-Pacific region to share the recent progress of modeling, simulation and measurement for the electrical design issues on chip, package and system levels.
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