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The 22nd edition of IITC is sponsored by the IEEE Electron Devices Society as the premier conference for interconnect technology devoted of advanced metallization and 3D integration for ULSI IC applications. Starting as a workshop on refractory metals and silicides in the 1980’s and moving towards advanced metallization in 1995, the 28th edition of MAM is devoted to research on materials properties and interactions of interconnect and silicide materials. These two conferences will be combined again in 2019 for the 3rd joint IITC-MAM conference.
