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International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) will feature worldwide leading experts and engineers together in sharing state-of-the-art advanced microelectronic packaging and PCB technology. The IMPACT Conference is the largest gathering of packaging and PCB professionals in Taiwan. To reflect the cutting-edges technology development, the IMPACT Conference highlights “IMPACT on Mobile and Flexible Electronics”. Moreover, the IMPACT Conference keeps collaborating with international organizations such as ICEP from Japan and iNEMI from U.S.A this year. We hope this conference will become a remarkable platform to show your technology research and capability.