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ECTC — 2018 IEEE 68th Electronic Components and Technologies Conference

29th May 2018 - 1st June 2018
San Diego, California, United States


ECTC is the premier international conference sponsored by the IEEE Components, Packaging and Manufacturing Technology (CPMT) Society. ECTC papers comprise a wide spectrum of topics, including 3D packaging, electronic components, materials, assembly, interconnections, device and system packaging, optoelectronics, reliability, and simulation

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