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InterPACK 2021 — International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems

26th October 2021   -   28th October 2021
Online, United States
https://event.asme.org/InterPACK
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Abstract

InterPACK is the premier international conference for exchange of state-of-the-art knowledge in research, development, manufacturing, and applications of electronics packaging and heterogeneous integration. It is the flagship conference of the ASME Electronic and Photonic Packaging Division (EPPD).