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SPI - 2017 IEEE 21st Workshop on Signal and Power Integrity

7th May 2017 - 10th May 2017
Baveno (VB), Lithuania


Characterization, modeling and design for signal and power integrity of electronic systems. Modeling, simulation and measurement of electrical interconnect performance at chip, board and package levels. Innovative CAD concepts and algorithms. Applications to computing devices, mobile devices, automotive/aerospace.

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